In June, Hoosier Pattern was awarded a Global Supply Chain SOLVE Solution Award by Emerson Process Management. Emerson gives this award to outstanding project owners that impact the way their supply chain works. The objective of The Global Supply Chain's Solution Award is to encourage and recognize people's efforts on providing supply chain related solutions to the business. In line with the SOLVE vision (defined below) there must also be value added to the business via enterprise engagement, financial improvement, delivery improvement and asset management improvement. The Solution Award is going to be given once in a calendar year and/or completion of a Solution project. The nominees for the award are individuals and/or teams inside and outside of the Global Supply Chain's organization and recipients are chosen by Global Supply Chain leadership, in alignment with Enterprise Leadership. Hoosier Pattern is the only external supplier to receive a Solution award.
Global Supply Chain's vision of SOLVE includes:
S - Solution provider on: delivery challenges, dwell time and asset management targets
O - On-time delivery improvement with all suppliers achieving 95% OTD to request date
L - Lead time reduction: work with suppliers to shorten lead-times demanded by KOB's
V - Value add to our financial position: deliver supply chain related financial targets on NMI, DPO, ES
E - Enterprise engagement via perfect execution: driving regional actions in line with global Enterprise objectives
HPI is honored and thrilled to be the recipient of the SOLVE award. Our employees take pride in their work and the quality of everything that leaves our facility reflects that. We will continue to strive to be an industry leader in 3D printed sand, constantly working to be better and finding ways to do things differently. The HPI team is mindful of the need to compete for excellence and will always work together as one to keep that goal in mind. We look forward to our future with Emerson and continuing to make that partnership a stronger one.
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